Method of making semiconductor devices employing first and...

Details Method of making semiconductor devices employing first and... Method of making semiconductor devices employing first and...

2011-06-07

2011-06-07

Le, Dung A. (Department: 2818)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

With attachment to temporary support or carrier

C438S108000, C438S109000, C438S612000, C438S613000

Reexamination Certificate

active

07955954

ABSTRACT:
A semiconductor device and method. One embodiment provides an integral array of first carriers and an integral array of second carries connected to the integral array of first carriers. First semiconductor chips are arranged on the integral array of first carriers. The integral array of second carriers is arranged over the first semiconductor chips.

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The First Office Action for Chinese Patent Application No. 200910134172.7 issued Apr. 23, 2010 (9 pages).

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