Method of making semiconductor device with flip chip mounting

Details Method of making semiconductor device with flip chip mounting Method of making semiconductor device with flip chip mounting

2005-05-03

2005-05-03

Thompson, Craig A. (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S613000, C257S772000, C257S778000

Reexamination Certificate

active

06887738

ABSTRACT:
A semiconductor device is arranged such that a semiconductor chip having electrodes is flip chip mounted on printed substrate pads on a printed wiring substrate by a bump formed on each electrode. The semiconductor chip and the printed wiring substrate are fixed with a thermo-setting resin. A penetration hole is formed within an area where the printed substrate pad contacts each gold bump, and the gold bump has a joint section also on a side face of the penetration hole of the printed substrate pad. With this structure, the semiconductor device has a secure electrical connection between the bump and the metal pattern.

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Japanese Office Action dated Sep. 9, 2003 along with English Translation.

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