Method of making semiconductor device packaged by sealing...

Details Method of making semiconductor device packaged by sealing... Method of making semiconductor device packaged by sealing...

2011-08-30

2011-08-30

Sefer, A. (Department: 2893)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S124000, C257SE21509, C257SE21599

Reexamination Certificate

active

08008129

ABSTRACT:
A method of manufacturing a semiconductor device and a semiconductor device including a first semiconductor element mounted on a first surface of a base plate, wherein solder balls are formed on a second opposite surface of the base plate-such that the second opposite surface includes an area without solder balls. At least one second semiconductor element is mounted to the base plate at the area of the second surface without solder balls. The at least one semiconductor element may be mounted to the base plate using low molecular adhesive, or in the alternative, high temperature solder.

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