Semiconductor device manufacturing: process – Gettering of substrate
Patent
1998-01-21
2000-12-19
Dang, Trung
Semiconductor device manufacturing: process
Gettering of substrate
438162, 438166, 438143, 438149, 438164, 438473, H01L 21322
Patent
active
061627046
ABSTRACT:
To provide a method of removing a catalyst element from a crystalline silicon film obtained by solid phase growth using the catalyst element promoting crystallization, phosphorus is implanted selectively to the crystalline silicon film having the catalyst element whereby a portion of the silicon film implanted with phosphorus is made amorphous, and when a thermal annealing treatment is performed and the silicon film is heated, the catalyst element is moved to an amorphous portion implanted with phosphorus having large gettering capacity by which the concentration of the catalyst element in the silicon film is lowered and a semiconductor device is fabricated by using the silicon film.
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Ohnuma Hideto
Ohtani Hisashi
Takano Tamae
Yamazaki Shunpei
Dang Trung
Semiconductor Energy Laboratory Co,. Ltd.
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