Method of making semiconductor chip package

Details Method of making semiconductor chip package Method of making semiconductor chip package

1999-11-19

2001-08-07

Niebling, John F. (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S127000

Reexamination Certificate

active

06271057

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
This invention relates to semiconductor chip packages and a method of making such semiconductor chip packages.
2. Description of the Related Art
FIG. 1
is a semiconductor chip package
10
according to a preferred embodiment disclosed in R. O. C. Publication No. 348306 entitled “Device Having Resin Package And Method Of Producing The Same”. The semiconductor chip package
10
includes a chip
110
securely attached to a resin insulating layer
122
. The chip
110
has a plurality of bonding pads
110
a
used to electrically access the inner circuits thereof. The resin insulating layer
122
has a plurality of through-holes
122
a
disposed around the semiconductor chip
110
. The lower surface of the resin insulating layer
122
is provided with a plurality of connection pads
140
a
. The bonding pads
110
a
of the chip
110
are connected to the connection pads
140
a
by a plurality of bonding wires
130
. The semiconductor chip
110
, the upper surface of the resin insulating layer
122
and the bonding wires
130
are encapsulated by a package body
150
. The semiconductor chip package
100
can be mounted to a substrate, such as a printed circuit board, like other leadless devices.
R. O. C. Publication No. 348306 also discloses a method of producing the semiconductor chip package
10
. The method mainly utilizes a metallic frame
170
(as shown in
FIG. 2
) to produce a plurality of the chip packages
10
simultaneously. The method includes: (A) forming a photoresist layer over the metallic frame
170
, transferring the desired pattern, and developing in a manner that areas on the metallic frame
170
corresponding to the connection pads
140
a
are not covered by the photoresist layer; (B) electroplating areas on the metallic frame
170
which are not covered by the photoresist layer with a layer of metal such as gold or platinum thereby forming the plurality of connection pads
140
a
; (C) removing the photoresist layer; (D) forming a resin insulating layer
122
over the metallic frame
170
and the connection pads
140
a
; (E) forming a plurality of through-holes
122
a
in the resin insulating layer
122
at locations corresponding to the connection pads
140
a
; (F) securely attaching the backside surface of the chip
110
to the metallic frame
170
using an adhesive layer; (G) electrically coupling the bonding pads
110
a
of the chip
110
to the corresponding connection pads
140
a
; (H) forming a package body
120
over the chip
110
. Finally, a separation process is taken to remove the metallic frame
170
. As shown in
FIG. 2
, the separation process typically is done by utilizing an etching agent to selectively dissolve the metallic frame
170
, with the connection pads
140
a
undissolved.
The method of making the semiconductor chip package
10
described above utilizes the metallic frame
170
to support the chip
110
during the assembly process, and then the metallic frame
170
needs to be removed by etching agent. Therefore, the method is quite complicated, expensive and time-consuming.
SUMMARY OF THE INVENTION
It is a primary object of the present invention to provide a method of making a semiconductor chip package which utilizes a flexible film carrier to support a semiconductor chip thereby simplifying the assembly process and cutting down the cost.
A method of making a semiconductor chip package in accordance with the present invention comprises the steps of: forming a plurality of through-holes in a flexible film carrier; laminating a metal layer on the lower surface of the flexible film carrier; etching the metal layer to form a plurality of connection pads, each connection pad has a portion exposed within the corresponding through-hole; forming a metal coating on the surfaces of the connection pads which are not covered by the flexible film carrier; attaching a semiconductor chip to a die receiving area on the upper surface of the flexible film carrier; electrically coupling bonding pads on the semiconductor chip to the front surfaces of the connection pads; forming a package body over the upper surface of the flexible film carrier and the semiconductor chip.
Since the method of making a semiconductor chip package in accordance with the present invention utilizes a flexible film carrier to support a semiconductor chip during the assembly process and the flexible film carrier can be directly removed, the method becomes simplified, cost-saving and time-saving.


REFERENCES:
patent: 5897337 (1999-04-01), Kata et al.
patent: 6117706 (2000-09-01), Yoshioka et al.
patent: 348306 (1985-11-01), None

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