Method of making semiconductor bonding bumps using metal cluster

Details Method of making semiconductor bonding bumps using metal cluster Method of making semiconductor bonding bumps using metal cluster

1991-02-11

1992-10-20

Chaudhuri, Oiik

Fishing, trapping, and vermin destroying

437930, H01L 21288

Patent

active

051569973

ABSTRACT:
A method of making bonding bumps on the pads of an electrical chip including depositing a layer of metallic adhesion material over the surface, depositing metallic bumps on the metallic adhesion material over each of the pad areas using a focused liquid metal ion source, and chemically etching the layer of metallic adhesion material off the surface outside of the deposited bumps.

REFERENCES:
patent: 4868068 (1989-09-01), Yamaguchi et al.
patent: 4876112 (1989-10-01), Kaito et al.

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