Method of making rigid-flexible multilayer board system

Details Method of making rigid-flexible multilayer board system Method of making rigid-flexible multilayer board system

1990-04-06

1991-09-17

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29840, 2281801, 2281802, 439 44, 439 47, 439 48, 439 67, H05K 336

Patent

active

050481665

ABSTRACT:
Mounting only electronic parts on a printed circuit board puts a limit on the mounting density. According to the invention, electronic parts are mounted on a flexible board. This flexible board is then mounted on a printed circuit board to thereby increase the mounting density.

REFERENCES:
patent: 4139881 (1979-02-01), Shimizu et al.
patent: 4506443 (1985-03-01), Itoh
patent: 4515304 (1985-05-01), Berger
patent: 4761881 (1988-08-01), Bora et al.

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