Method of making RFID device

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C029S825000, C029S832000, C029S601000, C029S592100, C343S867000, C343S7000MS, C340S572700

Reexamination Certificate

active

07120987

ABSTRACT:
A radio frequency identification (RFID) device includes a conductive pattern, such as an antenna, on one side of a substrate, and a chip, such as part of a strap, electrically coupled to the conductive pattern, and either on an opposite side of the substrate or on the same side of the substrate as the antenna. A method of fabricating the RFID device may include crimping the strap onto the substrate, in contact with a seed layer, which is subsequently used in forming the antenna or other conductive pattern by plating. The seed layer may be a patterned conductive ink layer. Alternatively, the seed layer may be a layer of conductive material deposited on the substrate, such as by vacuum deposition. Parts of the deposited layer may be covered with a patterned mask in order to form the desired configuration of the conductive pattern.

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