Method of making resistor with silicon-rich silicide contacts fo

Fishing – trapping – and vermin destroying

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437 52, 437 89, 437918, 437 60, 437200, H01L 2128

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054160340

ABSTRACT:
A method for fabricating a high impedance load device in an integrated circuit. An opening in an insulating layer is formed to expose a first region below the insulating layer. A region of a refractory metal silicide is formed in the opening. Then, the integrated circuit is annealed until a layer of epitaxial silicon from the refractory metal silicide is deposited on the region, wherein the layer of epitaxial silicon separates the first region from the refractory metal silicide.

REFERENCES:
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patent: 4597163 (1986-07-01), Tsang
patent: 4670970 (1987-06-01), Bajor
patent: 4892844 (1990-01-01), Cheung et al.
patent: 4951112 (1990-08-01), Choi et al.
patent: 5070038 (1991-12-01), Jin
IEEE Transactions on Electron Devices, vol. ED-30, No. 2, Feb. 1983 Masamichi Mori "Resistance Increase in Small-Area Si-Doped Al-n-Si Contacts" pp. 81-86.
Applied Physics Letters, vol. 31 No. 2, Jul. 1977, G. Majni et al. "Large-Area Uniform Growth of <100> S1 through Al Film By Solid Epitzxy" pp. 125-126.
Oppolzer et al., "Journal of Vacuum Science & Technology B", Oct.-Dec. 1984 vol. 2, pp. 630-635.

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