Method of making resin molded semiconductor device

Details Method of making resin molded semiconductor device Method of making resin molded semiconductor device

1991-07-01

1992-08-18

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437211, 437217, H01L 21283, H01L 2156, H01L 2158

Patent

active

051399695

ABSTRACT:
A resin molded semiconductor device includes external electrodes provided on and connected to the electrodes of a semiconductor element. The semiconductor device is produced by coating the electrodes of the semiconductor element with a coating resin encapsulating the semiconductor element in a sealing resin in a mold and then dissolving the coating resin. Then, a metal is disposed in the holes formed in the sealing resin to provide external electrodes. Since the external electrodes are provided on the electrodes of the semiconductor element, the packaging area has the same dimensions as the resin package, and the packaging area of the semiconductor device can be reduced.

REFERENCES:
patent: 4704369 (1987-11-01), Nath et al.

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