Chemistry: electrical and wave energy – Processes and products
Patent
1984-06-01
1985-06-04
Tufariello, Thomas
Chemistry: electrical and wave energy
Processes and products
204 384, C25D 502, C25D 700
Patent
active
045212805
ABSTRACT:
A method of making printed circuits, where on both sides sacrificial foils are laminated onto a synthetic resin prepreg. Through-holes are drilled. The copper foil is subsequently etched off. A negative photoresist foil is laminated on the prepreg surface roughened by etched-off copper dendrites. The foil is exposed and developed in accordance with the respective conductive pattern. Subsequently, copper is sputtered onto the surface of the photoresist, the surface and the bottom of the photoresist channels defining the conductors, and onto the surface of the drilled holes by means of magnetron-enhanced cathode sputtering. The copper sputtered onto the surface of the photoresist is removed by means of a scrubbing roller. Then, copper is deposited in accordance with the additive process on the copper sputtered in the photoresist channels and the drilled holes. After the stripping of the photoresist, the printed circuit is completed.
REFERENCES:
patent: 3554877 (1971-01-01), Geisler
patent: 4135988 (1979-01-01), Dugan et al.
patent: 4217182 (1980-08-01), Cross
patent: 4278511 (1981-07-01), Dugan
patent: 4304640 (1981-12-01), Walker
Bahrle Dieter K.
Schwerdt Friedrich W.
International Business Machines - Corporation
Levy Mark
Tufariello Thomas
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