Method of making printed circuit board by induction heating of t

Details Method of making printed circuit board by induction heating of t Method of making printed circuit board by induction heating of t

1979-09-25

1981-07-14

Smith, John D.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 96, 427191, 427192, 427202, 4273767, 427377, H05K 312

Patent

active

042787025

ABSTRACT:
A printed circuit board and a method of making the same is disclosed wherein a powdered conductive composition is placed on a dielectric substrate in a matrix corresponding to the desired electrical circuit pattern. The powdered conductive composition is then heated by induction so that the conductive particles are sintered to form continuous conductive pathways secured to the dielectric substrate. The use of relatively high frequency induction currents coupled with a relatively small size of the conductive particles results in rapid heating of the powdered conductive composition while leaving the underlying dielectric substrate unaffected by the induction heating.

REFERENCES:
patent: 2993815 (1961-07-01), Treptow
patent: 3321390 (1967-05-01), Weber
patent: 3410714 (1968-11-01), Jones
patent: 3647532 (1972-03-01), Friedman et al.
patent: 3705819 (1972-12-01), Heller et al.
patent: 3808046 (1974-04-01), Davey
patent: 4039700 (1977-08-01), Schmer
patent: 4072771 (1978-02-01), Grier
Goldman, "Control of Paste Spreading in Screening Process" IBM TDB vol. 19, No. 11, Apr. 1977.
Electronics, 50, No. 2, p. 144, 1-1977, "Inks for Hybrids Match Alumina".

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