Method of making printed circuit board

Details Method of making printed circuit board Method of making printed circuit board

1995-01-19

1997-11-11

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29830, 29852, 361792, 361799, H05K 334

Patent

active

056850700

ABSTRACT:
A printed circuit board or card for direct chip attachment that includes at least one power core, at least one signal plane that is adjacent to the power core, and plated through holes for electrical connection is provided. In addition, a layer of dielectric material is adjacent the power core and a circuitized conductive layer is adjacent the dielectric material, followed by a layer of photosensitive dielectric material adjacent the conductive layer. Photodeveloped blind vias for subsequent connection to the power core and drilled blind vias for subsequent connection to the signal plane are provided. Also provided is process for fabricating the printed circuit board or card for direct chip attachment.

REFERENCES:
patent: 3436819 (1969-04-01), Lunine
patent: 4150421 (1979-04-01), Nishihara et al.
patent: 4572764 (1986-02-01), Fan
patent: 4642160 (1987-02-01), Burgess
patent: 4675789 (1987-06-01), Kuwablea et al.
patent: 4854038 (1989-08-01), Wiley
patent: 4864722 (1989-09-01), Lazzarini et al.
patent: 4935584 (1990-06-01), Boggs
patent: 5025555 (1991-06-01), Mase
patent: 5048178 (1991-09-01), Bindra et al.
IBM Tech Disclosure Bulletin vol. 20 No. 12 May 1978 pp. 5172-5174 by W. Fedrowitz et al.

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