Method of making pressure sensor assemblies

Details Method of making pressure sensor assemblies Method of making pressure sensor assemblies

2007-04-27

2008-09-09

Hong, John C (Department: 3726)

Metal working

Method of mechanical manufacture

Combined manufacture including applying or shaping of fluent...

C073S754000

Reexamination Certificate

active

07421773

ABSTRACT:
Silicon-based high pressure sensor modules are manufactured in an array arrangement, incorporating a low temperature cofired ceramic (LTCC) substrate. The LTCC substrate can withstand high pressures. Bossed containers filled with oil are mounted on the substrate in an array. These bossed containers house the sensor cells which are composed of a sensor handle wafer and a diaphragm. The top surface of these bossed containers are flexible and deflect under pressure. By controlling the surface area and the thickness of the top surface, the pressure sensors can be configured to measure a wide range of pressures. The oil transfers pressure from the bossed container to the diaphragm of the sensor cell while protecting the sensor cell from high pressures and harsh media.

REFERENCES:
patent: 5926692 (1999-07-01), Kurtz

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