Method of making plastic encapsulated semiconductor devices

Details Method of making plastic encapsulated semiconductor devices Method of making plastic encapsulated semiconductor devices

1979-02-12

1981-08-18

Ozaki, G.

Metal working

Method of mechanical manufacture

Assembling or joining

29566, H01L 2128

Patent

active

042838380

ABSTRACT:
The present invention provides a plastic encapsulated semiconductor device which comprises a connected metal plate having a plurality of semiconductor element holding parts which are connected in series in one direction with at least two connecting arms, said connecting arms having sectional area smaller than that of said semiconductor element holding part and being disposed inside of the side surface of said semiconductor element holding parts in the connecting direction.
The invention provides a method of preparing semiconductor devices having relatively large current capacity of about 5 to 50 amperes used as diodes for automobiles and having high quality in the mass production.

REFERENCES:
patent: 3597666 (1971-08-01), Taskovich
patent: 3716764 (1973-02-01), Birchler
patent: 3735017 (1973-05-01), Manning
patent: 3742599 (1973-07-01), Desmond

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