Method of making packaged IC chip

Details Method of making packaged IC chip Method of making packaged IC chip

1986-01-27

1987-03-31

Hearn, Brian E.

Metal working

Method of mechanical manufacture

Assembling or joining

29588, 29589, 29591, 29827, H01L 2166

Patent

active

046531742

ABSTRACT:
In the manufacture of a packaged IC chip, a lead frame segment has a plurality of leads, the ends of which are connected to opposing rails. After the leads are secured to a lead frame support, the rails are removed and an IC chip is then connected. The chip and lead frame are then encapsulated between the support and a cover.

REFERENCES:
patent: 3484533 (1969-12-01), Kauffman
patent: 3529073 (1970-09-01), Leonard
patent: 3802069 (1974-04-01), Thompson
patent: 3882597 (1975-05-01), Chayka et al.
patent: 3906621 (1975-09-01), Epple
patent: 4012766 (1977-03-01), Phillips et al.
patent: 4142287 (1979-03-01), Grabbe
patent: 4413404 (1983-11-01), Burns

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