Metal working – Method of mechanical manufacture – Electrical device making
Patent
1989-06-30
1991-04-30
Hall, Carl E.
Metal working
Method of mechanical manufacture
Electrical device making
29846, 428901, H05K 336
Patent
active
050106414
ABSTRACT:
A method of making a multilayer printed circuit board providing sufficient internal distributed capacitance so as to eliminate the need for the by-pass capacitor conventionally provided in the vicinity of each integrated circuit mounted to the board. The method includes providing one or more fully-cured power-ground plane sandwich components which are laminated together with other partially cured component layers of the board. Each sandwich component comprises a conductive power plane layer and a conductive ground plane layer having a fully cured dielectric material therebetween. The thickness of the dielectric layer of each sandwich is chosen sufficiently thin to provide the desired distributed capacitance.
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IBM Tech Discl. Bull., vol. 27, No. 5, Oct. 1984, pp. 2829-2830, by L. N. Chellis, et al.
Arbes C. J.
Cass Nathan
Hall Carl E.
Starr Mark T.
Unisys Corp.
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