Method of making multilayer circuit boards having conformal Insu

Details Method of making multilayer circuit boards having conformal Insu Method of making multilayer circuit boards having conformal Insu

1990-01-10

1992-05-19

Ball, Michael W.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156285, 1563077, 156902, 361414, H05K 111, B32B 3120

Patent

active

051145189

ABSTRACT:
A multilayer circuit board having a conformal layer of an insulating material separating a circuit core from an adjacent insulating layer is disclosed. The conformal layer encapsulates the substrate and conductive pattern of circuit lines in the circuit core, thereby reducing failures caused by impurities trapped during lamination. The multilayer circuit board is manufactured by coating at least one circuit core with the conformal layer of insulating material before final lamination of the circuit cores into a multilayer circuit board.

REFERENCES:
patent: 2626206 (1953-01-01), Adler et al.
patent: 2934479 (1960-04-01), Deer
patent: 3509624 (1970-05-01), Boucher
patent: 3740678 (1973-06-01), Hill
patent: 3932932 (1976-01-01), Goodman
patent: 4180608 (1979-12-01), Del
patent: 4496793 (1985-01-01), Hanson et al.
patent: 4591220 (1986-05-01), Impey
patent: 4606787 (1986-08-01), Pelligrino
patent: 4789423 (1988-12-01), Pelligrino

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