Method of making multilayer circuit

Details Method of making multilayer circuit Method of making multilayer circuit

1994-07-19

1997-01-07

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

174262, 174265, H05K 336

Patent

active

055904602

ABSTRACT:
An interposer for interconnection between microelectronic circuit panels has contacts at its surfaces. Each contact has a central axis normal to the surface and a peripheral portion adapted to expand radially outwardly from the central axis responsive to a force applied by a pad on the engaged circuit panel. Thus, when the circuit panels are compressed with the interposers, the contacts expand radially and wipe across the pads. The wiping action facilitates bonding of the contacts to the pads, as by conductive bonding material carried on the contacts themselves.

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