Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2007-01-30
2007-01-30
Dang, Phuc T. (Department: 2818)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C607S142000
Reexamination Certificate
active
11075772
ABSTRACT:
A transcutaneous electrode is disclosed having a sheet electrode of an electrically-conductive material with an electrically conductive layer affixed to a major portion of the lower surface thereof. A pad of electrically-conductive gel is applied to the lower surface of the sheet electrode over the electrically-conductive layer. An electrical conductor having an unsheathed end portion is secured to the upper surface of the sheet electrode by an electrically-conductive adhesive. A high dielectric cover overlays the end out portion of the electrical conductor, and is secured to the sheet electrode by the conductive adhesive. A method for making the electrode is also disclosed.
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Cook Alex McFarron Manzo Cummings & Mehler, Ltd.
Dang Phuc T.
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