Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1997-07-09
1999-01-12
Aftergut, Jeff H.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156217, 296021, H01F 2728
Patent
active
058581545
ABSTRACT:
Insulating flexible sheets and electroconductive flexible sheets having electroconductive patterns are stacked alternately into a multi-layer structure to form a laminated body. The inclining directions of the obliquely formed electroconductive patterns are varied alternately from layer to layer, and the patterns of different layers are electrically connected by electroconductive connecting parts formed on the insulating sheets. A pattern of a single line wound in the same direction is formed by rounding the laminated body so as to connect the patterns to each other and thereby form a cylindrical multi-layer coil. Further, by opening the connecting part to make it a tapping part and reducing the number of turns of the multi-layer coil, the inductance of the coil can be set as desired. Alternatively, the electroconductive patterns are formed with the same inclination and the connecting part on each insulating flexible sheet is opened to make it a tapping part, so that each layer constitutes an independent single-layer coil. This plurality of single-layer coils are freely connected whether in series or in parallel.
REFERENCES:
patent: 3735306 (1973-05-01), Kabler et al.
patent: 4918418 (1990-04-01), Tsala
Moreno, J.S., "Printed Circuit Coil," IBM Technical Disclosure Bulletin, vol. 12, No. 6, Nov. 1969, p. 778.
Aftergut Jeff H.
NEC Corporation
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