Method of making molds for electrodeposition forming of microstr

Details Method of making molds for electrodeposition forming of microstr Method of making molds for electrodeposition forming of microstr

1991-03-20

1991-12-17

Tufariello, T. M.

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

Shaping against forming surface

205112, C25D 108

Patent

active

050732374

ABSTRACT:
In a method of making molds with microstructured recesses having a continuous base covered by a film of an electrically conductive material for forming in the recesses, by electrodeposition, microstructured plate-like bodies a microstructure master mold is pressed into a layer of thermoplastic material coated with a film of an electrically conductive material at a temperature which is above the softening temperature of the thermoplastic material such that the thermoplastic material with the electrically conductive film thereon first contacts the microstructure face and then enters the recesses in the microstructure. The master mold and thermoplastic material are then cooled and the master mold is removed whereby the thermoplastic material provides a negative mold of the microstructure having a continuous electrically conductive film disposed on the recess bases whereas the remainder of the electrically conductive film is broken apart and disposed in isolated spangles on the rest of the microstructured mold. The microstructured negative mold is then ready for electrodeposition of a metal in the microstructure recesses using the electrically conductive film therein as an electrode.

REFERENCES:
patent: 4661212 (1987-04-01), Ehrfeld et al.
H. Vollmer, W. Ehrfeld, P. Hagmann, "Fabrication of Microstructures with Extreme Structural Heights by Vacuum Reaction Injection Molding and Electroforming", May, 1987, Report kfk 4267, Kernforschungszentrum Karlsruhe, Germany, abstract.

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