Method of making molded resin casing of electronic part with fla

Details Method of making molded resin casing of electronic part with fla Method of making molded resin casing of electronic part with fla

1989-12-07

1991-12-10

Silbaugh, Jan H.

Plastic and nonmetallic article shaping or treating: processes

With severing, removing material from preform mechanically,...

Making hole or aperture in article

264163, 264266, 26427215, 264273, B28B 124, B28B 148, B29D 2322

Patent

active

050716115

ABSTRACT:
A molded resin casing of an electronic part equipped with a flat cable and internally accommodating a board on which are formed electric conductor patterns slidingly contacted by contacts of a slider of the electronic part. A flexible board having various electric conductor patterns formed on a synthetic resin film is used as the board, the flexible board is formed integral with a flat cable including a synthetic resin film on which are formed electric conductor patterns electrically connected to the aforementioned various electric conductor patterns, and when the molded resin casing is molded by injecting a molten synthetic resin, the flexible board is inserted in such a manner that the electric conductor patterns are exposed within the casing, thereby integrating the flexible board and synthetic resin casing, with the flat cable extending outwardly from a side portion of the synthetic resin casing.

REFERENCES:
patent: 3444618 (1969-05-01), Sorlie
patent: 3800368 (1974-04-01), Simon
patent: 3809733 (1974-05-01), Sandiford et al.
patent: 4429297 (1984-01-01), Nakatsu
patent: 4477795 (1984-10-01), Henmi et al.
patent: 4479106 (1984-10-01), Shimizu et al.
patent: 4479107 (1984-10-01), Bleeke
patent: 4705469 (1987-11-01), Liebl et al.
patent: 4734672 (1988-03-01), Kawana et al.

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