Method of making molded circuit board

Metal working – Method of mechanical manufacture – Structural member making

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Details

29852, 174 685, 264104, 264265, 26427217, 427 96, 427 97, H05K 302

Patent

active

046047999

ABSTRACT:
A method of making a molded circuit board includes forming a polymer base with a channel and an intersecting through-hole. The base is conductively coated by means of vacuum deposition to establish a circuit line. After the conductive coating is removed everywhere except the channel and the through-hole, a further conductive material is provided on the coating. The base is subsequently stress relieved and planarized.

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