Method of making microwave, multifunction modules using fluoropo

Details Method of making microwave, multifunction modules using fluoropo Method of making microwave, multifunction modules using fluoropo

1998-11-25

2000-08-08

Watkins, III, William P.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156 52, 156 53, 156 56, 1563082, 174260, 361761, 361762, 361763, 361764, 438456, 438455, 428138, 428131, 428137, 428901, 428195, 428166, 428178, 428421, 29846, 29848, 29830, 29855, 29856, 29849, 257687, 257724, H05K 118, H05K 116, B32B 324

Patent

active

060996773

ABSTRACT:
A platform is provided for the manufacture of microwave, multilayer integrated circuits and microwave, multifunction modules. The manufacturing process involves bonding fluoropolymer composite substrates into a multilayer structure using fusion bonding. The bonded multilayers, with embedded semiconductor devices, etched resistors and circuit patterns, and plated via holes form a self-contained surface mount module. Film bonding, or fusion bonding if possible, may be used to cover embedded semiconductor devices, including embedded active semiconductor devices, with one or more layers.

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Ledain, Bernard, et al., "Innovative Multilayer Technologies For Active Phased Array Antennas," Dassault Electronique, Saint-Cloud, France.

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