Method of making microwave circuit package

Details Method of making microwave circuit package Method of making microwave circuit package

1996-11-01

1998-11-10

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29832, 29852, 333246, 333247, H05K 334

Patent

active

058325980

ABSTRACT:
A low cost microwave circuit package having high performance characteristics is disclosed. The package operates in the frequency range up to 90 GHz while requiring less space on the printed circuit board. Space savings is provided by small components and the leadless design of the package. Taking the place of leads is a ball grid array and RF ports. close to ##EQU1## within the operating frequency band of the package, for any pair of signal transmission ports.

REFERENCES:
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patent: 4276558 (1981-06-01), Ho et al.
patent: 4875087 (1989-10-01), Miyauchi et al.
patent: 5014115 (1991-05-01), Moser
patent: 5023624 (1991-06-01), Heckaman et al.
patent: 5202648 (1993-04-01), McCandless
patent: 5422615 (1995-06-01), Shibagaki et al.
patent: 5450046 (1995-09-01), Kosugi et al.

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