Method of making microelectronic spring contact array

Details Method of making microelectronic spring contact array Method of making microelectronic spring contact array

2006-05-23

2006-05-23

Bryant, David P. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S885000, C029S876000, C029S874000, C029S846000, C029S837000

Reexamination Certificate

active

07047638

ABSTRACT:
A method of making a microelectronic spring contact array comprises forming a plurality of spring contacts on a sacrificial substrate and then releasing the spring contacts from the sacrificial substrate. Each of the spring contacts has an elongated beam having a base end. The method of making the array includes attaching the spring contacts at their base ends to a base substrate after they have been released entirely from the sacrificial substrate, so that each contact extends from the base substrate to a distal end of its beams. The distal ends are aligned with a predetermined array of tip positions. In an embodiment of the invention, the spring contacts are formed by patterning contours of the spring contacts in a sacrificial layer on the sacrificial substrate. The walls of patterned recesses in the sacrificial layer define side profiles of the spring contacts, and a conductive material is deposited in the recesses to form the elongated beams of the spring contacts.

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