Method of making microelectronic device package containing a liq

Details Method of making microelectronic device package containing a liq Method of making microelectronic device package containing a liq

1993-09-13

1995-05-09

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437248, 257712, 257713, 257714, H01L 2156

Patent

active

054139651

ABSTRACT:
A method for manufacturing a liquid-containing microelectronic device package. The method includes steps of providing (32) a base (16) including a microelectronic device (22) and a seal area disposed peripherally about the base (16), providing (34) a lid (12) and providing (34) a sealant (14) disposed between the base (16) and lid (12). The method also includes steps of immersing (36) the base (16), sealant (14) and lid (12) in a liquid (24) having a temperature above a sealant activation temperature and maintaining (38) the base (16), sealant (14) and lid (12) in the liquid (24) for a time sufficient to allow the liquid (24) to enter between the base (16) and lid (12) and to heat and thereby activate the sealant (14). The method further includes removing (40) the base (16), lid (12) and sealant (14) from the liquid (24) to provide a sealed, liquid-containing microelectronic device package (10).

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Nelson et al., "Thermal Performance of an Integral Immersion Cooled Multichip Module Package," Microelectronics and Computer Technology Corporation Technical Report, 1992.
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