Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1976-12-02
1978-07-11
Lesmes, George F.
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
156630, 156665, 156901, 427 98, 427307, 428418, 428447, 428450, 428901, B05D 512, B32B 1508
Patent
active
041003128
ABSTRACT:
An improvement is obtained in the bond strength between members of a laminate comprising a plastic substrate and a metal film through a process of first laminating to the plastic substrate a thin, sacrificial, anodized metal foil while providing at the interface prior to laminating of the foil to the plastic at least a mono molecular film of an organic silicon compound. After laminating the treated metal foil to the substrate under heat and pressure, the foil is chemically stripped from the substrate, leaving a surface of improved receptivity for conventional electroless plating and electroplating procedures, or other metallizing techniques. The final metal film when applied to the substrate exhibits consistently better adhesive strength than is obtained without the organic silicon treatment of the interface, especially in respect to adhesive strength at elevated temperature.
REFERENCES:
patent: 3445326 (1969-05-01), Hurst
patent: 3585103 (1971-06-01), Thomson
patent: 3619246 (1971-11-01), Bragole
patent: 3620933 (1971-11-01), Grunwald et al.
patent: 3640829 (1972-02-01), Elton
patent: 3753932 (1973-08-01), Jenkins
patent: 3808028 (1974-04-01), Lando
patent: 3846168 (1974-11-01), Elmore
patent: 3903326 (1975-09-01), Mikesell
D'Ottavio Eugene D.
Grunwald John J.
Jacovich Elaine F.
Lombardo Michael S.
Lesmes George F.
MacDermid Incorporated
Thibodeau P. J.
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