Method of making master slice type integrated circuit device

Details Method of making master slice type integrated circuit device Method of making master slice type integrated circuit device

1991-03-04

1993-02-09

Thomas, Tom

Fishing, trapping, and vermin destroying

437 41, 437 42, 437 45, 437195, H01L 2170

Patent

active

051852837

ABSTRACT:
This invention is to realize a final circuit by wiring only the top layer depending on the individual circuits, by fabricating a master slice in the step of up to forming plural semiconductor elements such as transistors on a semiconductor substrate, forming a lower layer of versatile wiring pieces thereon, and forming contact holes thereon. In this way, since the step just before formation of the top layer wiring can be carried out regardless of the features of individual circuits, preliminary mass productions are possible, and final products can be completed only by forming the wiring of the top layer depending on the requirements of the users. Accordingly, it is applicable to a wide variety of products, and the term for development and manufacture can be tremendously shortened.

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