Method of making light emitting diodes

Details Method of making light emitting diodes Method of making light emitting diodes

2008-12-09

2010-06-29

Smith, Zandra (Department: 2822)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

C438S022000, C438S026000, C257S099000

Reexamination Certificate

active

07745241

ABSTRACT:
A method of making a plurality of light emitting diodes simultaneously includes steps of: a) providing a wafer and a first bonding layer, and adhering the first bonding layer to a bottom side of the wafer; b) cutting the wafer to form a plurality of LED dies on the first bonding layer; c) adhering a second bonding layer on top sides of the plurality of LED dies; d) removing the first bonding layer; e) mounting the second bonding layer with the plurality of LED dies on a base having a plurality of recesses; f) removing the second bonding layer and letting the plurality of LED dies fall into the recesses of the base; g) electrically connecting the LED dies to electric poles in the base; h) encapsulating the LED dies; and i) cutting the base to form the plurality of LEDs.

REFERENCES:
patent: 7329905 (2008-02-01), Ibbetson et al.
patent: 2001/0000208 (2001-04-01), Bergeron et al.
patent: 2008/0224153 (2008-09-01), Tomoda
patent: 2009/0039762 (2009-02-01), Park et al.

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