Method of making leadframe for lead-on-chip (LOC) semiconductor

Details Method of making leadframe for lead-on-chip (LOC) semiconductor Method of making leadframe for lead-on-chip (LOC) semiconductor

1996-03-13

1998-03-10

Vo, Peter

Metal working

Method of mechanical manufacture

Electrical device making

29856, H01R 4300, H01L 2160

Patent

active

057247269

ABSTRACT:
A method of making a semiconductor device having a lead-on-chip structure includes bending a die pad extending from an outer frame outwardly from the outer frame. Thereafter, with the die pad in a convenient position, a semiconductor chip is die-bonded to the die pad. Thereafter, the die pad is bent back toward the outer frame so that it is generally parallel to but spaced from the outer frame with leads extending from the outer frame being generally parallel to the semiconductor chip. Electrodes of the semiconductor chip are connected by wire-bonding to the leads extending from the outer frame. After resin molding, the outer frame lying outside the resin package is severed and removed, completing the lead-on-chip semiconductor device.

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IBM Technical Disclosure Bulletin, vol. 15, No. 12, May 1973, pp. 3612-3613 .

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