Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent
1998-04-06
2000-08-29
Bowers, Charles
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
257669, 257670, H01L 23495
Patent
active
061113077
ABSTRACT:
A lead frame and method of making the same are provided. The lead frame includes a die mounting portion, first and second pairs of tie bars, and first and second tie bar bridges extending between respective second extension portions of each tie bar pair. First and second pairs of tie bars are mechanically coupled to respective first and second ends of the die mounting portion. Each of the tie bars includes a first extension portion, a second extension portion, a tie bar span mechanically coupled to the first end of the die mounting portion via the first extension portion, a tie bar flap formed along a longitudinal reinforcement crease, and a lateral reinforcement portion extending from said first extension portion to said die mounting portion. The tie bar flap and the tie bar span lie in intersecting planes and are connected along the longitudinal reinforcement crease between the first extension portion and the second extension portion. The lateral reinforcement portion extends in a direction perpendicular to a direction of said longitudinal reinforcement crease. A first tie bar bridge extends between respective second extension portions of a first tie bar of the first pair of tie bars and a second tie bar of the first pair of tie bars. A second tie bar bridge extends between respective second extension portions of a first tie bar of the second pair of tie bars and a second tie bar of the second pair of tie bars.
REFERENCES:
patent: 5150194 (1992-09-01), Brooks et al.
patent: 5197183 (1993-03-01), Chia et al.
patent: 5446959 (1995-09-01), Kim et al.
patent: 5612853 (1997-03-01), Kim et al.
patent: 5920116 (1999-07-01), Umehara et al.
Bowers Charles
Brewster William M.
Micro)n Technology, Inc.
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