Metal working – Method of mechanical manufacture – Electrical device making
Patent
1993-06-08
1994-09-20
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
174 522, 437207, 437217, 437220, H01R 4300
Patent
active
053477090
ABSTRACT:
A lead frame at least provides a semiconductor-element-mounting portion, plural leads and plural auxiliary leads. The auxiliary leads are arranged to be associated with plural leads, while a tie bar is provided and connected among the leads. According to a method of making the lead frame, an IC-chip mounting process, a wire-bonding process, a sealing process, a resin-cutting process and a dambar-cutting process are sequentially effected on the lead frame. After effecting the dambar-cutting process, a thin-plating process is effected so as to form a thin-plated layer, approximately having a thickness of 5 .mu.m to 15 .mu.m, on the leads. Then, the leads are bent by a predetermined bending process. Thereafter, a thick-plating process is effected so as to form an uniform thick-plated layer, approximately having a thickness of 15 .mu.m to 100 .mu.m, on the leads. After effecting the thick-plating process, a trimming process is effected on the leads. Incidentally, the thin-plating process can be effected after the bending process and before the thick-plating process.
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Maejima Yoshihisa
Nishimura Seiya
Ohta Tokuyoshi
Takabayashi Masayoshi
Arbes Carl J.
Yamaha Corporation
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