Method of making integrated waveguide cavities

Details Method of making integrated waveguide cavities Method of making integrated waveguide cavities

1980-03-04

1981-07-21

Weisstuch, Aaron

Metal working

Method of mechanical manufacture

Assembling or joining

29601, 29589, 29591, H01P 1100

Patent

active

042790700

ABSTRACT:
This invention provides a method for forming a waveguide cavity as a step in the process of diode fabrication. Semiconductor diodes are formed in a conventional manner. A plate of waveguide material having a thickness equivalent to waveguide height and slots corresponding to waveguide width is bonded to a semiconductor wafer containing a number of diodes. The slots are formed to correspond to rows of diodes, so that when bonded the diodes are centered in the slot. The package may then be divided as needed and the sides and thickness of the slot form the waveguide.

REFERENCES:
patent: 3916510 (1975-11-01), Martin
patent: 4023258 (1977-05-01), Carlson et al.
patent: 4023260 (1977-05-01), Schneider
patent: 4102037 (1978-07-01), Espaignol et al.

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