Method of making implanted device regions in a semiconductor usi

Metal working – Method of mechanical manufacture – Assembling or joining

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29571, 29579, 148 15, 148187, 148DIG82, 148DIG104, H01L 21265

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active

046759816

ABSTRACT:
A method of manufacturing an MOS transistor comprises the steps of forming a silicon nitride film on a central portion of a P-type silicon substrate, forming a first resist pattern on the semiconductor substrate and the film using a mask member having a central opening, ion-implanting a first impurity of P-type into the substrate using the first resist pattern and the film as masks, removing the first resist pattern from the semiconductor substrate, forming a second resist pattern on the substrate using the mask member, and ion-implanting a second impurity of P-type into the substrate at a low acceleration voltage using the second resist pattern as a mask. Then, a gate electrode is formed on the substrate and an impurity of n-type is implanted into the substrate to form source and drain regions of n-type.

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