Method of making IC card

Details Method of making IC card Method of making IC card

1994-12-02

1996-05-28

Kuhns, Allan R.

Plastic and nonmetallic article shaping or treating: processes

Pore forming in situ

Composite article making

264 466, 264161, 26427217, 425812, B29C 4406, B29C 4412

Patent

active

055208630

ABSTRACT:
A method for producing an IC card including filling a confined space with a mixture including a foaming resin, the mixture having not been foamed yet, the space being confined by a frame having cut-out portions on inner edges and at least one through-hole passing through the frame in the lateral direction between the inside and the outside of the frame, a circuit board on which functional components are mounted and having edges fitted to one of the cut-out portions of the frame so that the surface of the circuit board on which functional components are mounted faces inward, the frame and the circuit board forming a substantially flat outer surface, and a thin plate having edges fitted to another of the cut-out portions of the frame with the thin plate opposing the circuit board, the frame and the thin plate forming a substantially flat outer surface; foaming the mixture at a predetermined temperature for a predetermined time, thus filling the confined space with foamed resin, and thus making the foamed resin a structural member having mechanical strength, molding the frame, the circuit board, and the thin plate into one body; and removing excess foamed resin from the through-hole in the frame.

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patent: 5210442 (1993-05-01), Ishimoto
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