Method of making IC card

Metal working – Method of mechanical manufacture – Electrical device making

Patent

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Details

29837, 29855, 156291, 156293, 156295, 174 523, 257679, 26427214, 26427217, 26427221, 361737, 361764, 437219, H05K 330, H05K 1304, B29C 4503, B32B 3112

Patent

active

057350400

ABSTRACT:
A method of producing a thin IC card having a built-in battery includes forming a through-hole including an edge in a circuit board having obverse and reverse main surfaces, a circuit pattern being present on a first of the main surfaces of the circuit board; mounting a functional part on the first of the main surfaces of the circuit board; molding said circuit board and said functional part in a resin with a second main surface of said circuit exposed and forming a battery lodging section in the resin molding defined by the through-hole; and mounting a battery in said battery lodging section and electrically connecting the circuit pattern to the battery.

REFERENCES:
patent: 4668314 (1987-05-01), Endoh et al.
patent: 4746392 (1988-05-01), Hoppe
patent: 4829666 (1989-05-01), Haghiri-Tehrani et al.
patent: 5203078 (1993-04-01), Nakanishi et al.

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