Method of making homogeneous thermoplastic semi-conductor chip c

Details Method of making homogeneous thermoplastic semi-conductor chip c Method of making homogeneous thermoplastic semi-conductor chip c

1994-11-28

1996-01-16

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29830, 257666, 437220, 174 522, 174 523, 174 524, H01R 4300

Patent

active

054837405

ABSTRACT:
A homogeneous thermoplastic semi-conductor chip carrier cavity package (HC package) which utilizes the same thermoplastic for various integral attachments to the HC package, such as, a molded lid and a circuit substrate. A chemical bonding or fusing of the integral attachments to the HC package provides increased protection from having moisture enter into the cavity of the HC package. The HC package eliminates problems which are associated with having different coefficients of thermal expansion for the HC package and its various integral attachments.

REFERENCES:
patent: 4750092 (1988-06-01), Werther
patent: 5177032 (1993-01-01), Fogal et al.

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