Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1987-05-18
1988-02-23
Cashion, Jr., Merrell C.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156290, 156292, 1563066, 162149, B29C 6554
Patent
active
047268638
ABSTRACT:
A method of producing paperboard and a paperboard structure wherein the grain lines of upper and lower chipboard panels are aligned at right angles in relation to the undulations formed in a midstratum layer to yield an overall panel assembly having a high degree of bending resistance.
The invention also relates generally to a panel method of assembly having a particular novel layered construction. In place of a conventional solid chipboard laminated construction, an undulated midstratum layer is utilized in such manner that air cells or pockets are formed within the structure. An overlayer and an underlayer are adhesively applied to the undulated midstratum layer. The invention results in a panel assembly which may be much more economically manufactured while yielding superior end product strength and durability. The invention has widespread utility as a superior substitute for the currently used solid laminated chipboard design.
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Cashion Jr. Merrell C.
Corra-Board Products Co., Inc.
O'Connor Daniel J.
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