Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1983-07-25
1988-10-04
Ball, Michael W.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156239, 156246, 264213, 427 96, 427282, B29B 100, B44C 116, B29C 3340, B05D 512
Patent
active
047754397
ABSTRACT:
A low temperature method of forming a circuit pattern on a plastic substrate which comprises applying a slurry of a vaporizable solvent, metal particles and a small quantity of binder in the shape of the circuit pattern desired to a removable layer, vaporizing the solvent, covering the powdered metal and binder with an adhesive to hold the powdered metal and carrier in place on the removable layer, laminating the hydrocarbon containing substrate with pressure and heat to cause compacting of said powder and bonding of said compacted powder to said substrate by adhesive layer, said heat being insufficient to destroy said adhesive, substrate and removable layer, and separation of the removable layer. A circuit pattern held on a removable layer by an adhesive overlying same is also disclosed.
REFERENCES:
patent: 2721152 (1955-10-01), Hopf et al.
patent: 2721153 (1955-10-01), Hopf et al.
patent: 3589962 (1971-06-01), Bonjour
patent: 3703603 (1972-11-01), Levesque et al.
patent: 4049844 (1977-09-01), Bolon et al.
patent: 4322316 (1982-03-01), Provance et al.
patent: 4343833 (1982-08-01), Sawae et al.
patent: 4373019 (1983-02-01), Watanabe et al.
Morgan Noredin H.
Seeger, Jr. Richard E.
Amoco Corporation
Ball Michael W.
Falasco Louis
Magidson William H.
Medhurst Ralph C.
LandOfFree
Method of making high metal content circuit patterns on plastic does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of making high metal content circuit patterns on plastic , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making high metal content circuit patterns on plastic will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2154721