Method of making high input/output density MLC flat pack

Details Method of making high input/output density MLC flat pack Method of making high input/output density MLC flat pack

1995-10-10

1997-09-23

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

79852, 156 89, 257724, 264 61, 361772, H05K 336

Patent

active

056691360

ABSTRACT:
A high density I/O flat pack electronic component is provided comprising a multilayer ceramic substrate having internal electrical conductors for electrically connecting I/O pads on the periphery of the component to a chip on the electronic component.

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