Method of making high density sputtering targets

Details Method of making high density sputtering targets Method of making high density sputtering targets

1999-07-08

2000-12-26

Mai, Ngoclan

Powder metallurgy processes

Powder metallurgy processes with heating or sintering

Heat and pressure simultaneously to effect sintering

49 53, B22F 315

Patent

active

061654132

ABSTRACT:
There is provided a method for fabricating high density sputter targets by pre-packing a powder bed by hot pressing or vibration between metal plates, followed by hot isostatic pressing. This method is especially suitable for preparing sputter targets with a radius to thickness ratio of at least 3 and a density of at least 96% of theoretical.

REFERENCES:
patent: 4612162 (1986-09-01), Morgan et al.
patent: 4838935 (1989-06-01), Dunlop et al.
patent: 5248474 (1993-09-01), Morgan
patent: 6010583 (2000-01-01), Annavarapu et al.

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