Metal working – Method of mechanical manufacture – Assembling or joining
Patent
1982-12-03
1984-07-31
Roy, Upendra
Metal working
Method of mechanical manufacture
Assembling or joining
29571, 148 15, 148187, 357 42, 357 91, H01L 2122, H01L 2978, H01L 1114
Patent
active
044621515
ABSTRACT:
A simple process is provided which forms a bulk CMOS structure by depositing a layer of material which resists oxidation, e.g., a barrier layer of silicon nitride on an N- semiconductor substrate, forming a P well in the substrate through a given segment of the barrier layer, removing a first segment of the barrier layer to form N+ regions for N channel source and drain and N- substrate contact, removing a second segment of the barrier layer to form a P+ field region, removing a third segment of the barrier layer to form P+ regions for source and drain of a P channel device, forming a first control electrode having a given work function for the P channel device which acts as an ion barrier and then forming a second control electrode between the N channel source and drain regions having a work function different from that of the first control electrode.
REFERENCES:
patent: 3700507 (1972-10-01), Murray
patent: 3920481 (1975-11-01), Hu
patent: 4002501 (1977-01-01), Tamura
patent: 4045250 (1977-08-01), Dingwall
patent: 4110899 (1978-09-01), Nagasawa et al.
patent: 4183134 (1980-01-01), Oehler et al.
patent: 4268321 (1981-05-01), Meguro
patent: 4385947 (1983-05-01), Halfacre et al.
patent: 4391650 (1983-07-01), Pfeifer et al.
patent: 4406710 (1983-09-01), Davies et al.
patent: 4422885 (1983-12-01), Brower et al.
patent: 4433468 (1984-02-01), Kawamata
Geipel, Jr. Henry J.
Troutman Ronald R.
Wursthorn John M.
International Business Machines - Corporation
Limanek Stephen J.
Roy Upendra
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