Method of making hermetic feedthrough in ceramic substrate

Details Method of making hermetic feedthrough in ceramic substrate Method of making hermetic feedthrough in ceramic substrate

1987-04-02

1988-03-22

Niebling, John F.

Coating processes

Electrical product produced

Metal coating

29852, 204 15, 204 371, 427 96, 427 97, 427123, 4273762, 4273763, 4273767, H01L 2188, H05K 310

Patent

active

047327804

ABSTRACT:
A process for producing an hermetic feedthrough in a ceramic substrate by providing a sheet of liquid phase sinterable ceramic composition having a feedthrough hole, filling the feedthrough hole with refractory metal metallization material, firing the resulting structure to produce a sintered substrate and adherent metallization wherein the metallization is comprised of continuous phases of refractory metal and glass, contacting the refractory metal with electrically conductive intrusion metal and heating the resulting structure to a temperature at which the glassy phase is fluid, the refractory metal is solid, and the intrusion metal is liquid whereby the liquid metal preferentially wets the refractory metal, migrates into the metallization displacing glass and, upon subsequent solidification, partially or wholly occupies the volume space originally containing the continuous glass phase.

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N. V. Frederick et al., A Simple Technique for Metalizing Boron Nitride, The Review of Scientific Instruments, vol. 40, No. 9, (Sep. 1969), 1240-1241.
L. L. Trager, Plating Improvements for Metallized Ceramics, Technical Notes, A Publication of RCA/Princeton, N.J., TN No. 907, 5/1972.
Schwartz & Wilcox, Laminated Ceramics, Proceedings Electronic Components Conference, 1967, pp. 17-26.

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