Method of making for RF line replacable modules

Details Method of making for RF line replacable modules Method of making for RF line replacable modules

1989-04-20

1990-12-04

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

174 685, 357 81, H05K 330

Patent

active

049743171

ABSTRACT:
A thermal heat transfer member is disclosed for use in electronic or microwave systems with particular application to advanced avionic systems. This thermal heat transfer member for line replaceable module (LRM) comprises; a bottom cover, a grid partition bottom means, a solid thermal plane material fixedly interconnected to the grid partition bottom means, a grid partition top means fixedly interconnected upon the thermal plane, sandwiching the thermal plane between the grid partition top and the grid partition bottom, and finally, a top cover. The utilization of a "building block" approach and composite high strength heat-conductive materials designed to dissipate heat away from electronic devices and components mounted within the LRM operate to produce a radio frequency LRM of high heat conductivity with reduced weight ideal for utilization in advanced development avionic systems subject to extreme G-force and stress in avionic system operation.

REFERENCES:
patent: 3686533 (1972-08-01), Garnier et al.
patent: 4658334 (1987-04-01), McSparran et al.
patent: 4659931 (1987-04-01), Schmitz et al.
patent: 4718163 (1988-01-01), Berland et al.
patent: 4739443 (1988-04-01), Singhdeo
patent: 4748495 (1988-05-01), Kucharek

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