Method of making fluid system circuit board

Details Method of making fluid system circuit board Method of making fluid system circuit board

1976-12-15

1978-08-29

Weston, Caleb

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

137833, 156306, 156330, B32B 3104

Patent

active

041101405

ABSTRACT:
A fluid pneumatic circuit board includes a base plate and a flat cover plate molded of a suitable plastic such as polysulfone. The plates are chemically bonded with a thermal adhesive such as a refrigerated solid sheet of epoxy. The base plate has a planar surface within which the fluid circuit passageways, as well as structural board and component supports are integrally molded. The cover plate has individual sealing ribs formed to encircle each of the passageways. The epoxy sheet is shaped to cover the passageways, and with openings aligned with the exhaust openings in the cover plate. The plates, with the adhesive sheet therebetween, is clamped together and heated in an oven to soften the adhesive. The sealing rib has inclined sidewalls and an outer flat sealing wall, with an included angle of 60.degree. and a tip width equal to the sheet thickness and a height equal 21/2 times the sheet thickness. Moisture and/or gas in the softened plastic escape from under the tip and prevent formation of bubbles. Relatively small, reliable components can be internally mounted and bonded in place.

REFERENCES:
patent: 3467124 (1969-09-01), Simson
patent: 3533428 (1970-10-01), Ruedle
patent: 3539429 (1970-11-01), Kilduff et al.
patent: 3587607 (1971-06-01), Konig et al.

Affiliated with

Also associated with

Rating

Method of making fluid system circuit board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of making fluid system circuit board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making fluid system circuit board will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1631256