Method of making fine wire interconnections

Details Method of making fine wire interconnections Method of making fine wire interconnections

1982-03-15

1984-03-20

Godici, Nicholas P.

Metal fusion bonding

Process

Plural joints

B23K 2010, B23K 2000

Patent

active

044376049

ABSTRACT:
The present invention teaches a novel method of making ultrasonic fine wire interconnections between pads on a semiconductor chip and lead out terminals which may be performed with commercially available computer controlled automatic wire bonding machines having an ultrasonic bonding tool holder. A capillary wedge bonding tool is employed which has an annular working face similar in cross-section to a conventional narrow face bonding wedge. When the second bond of an interconnecting wire is made, the capillary wedge bonding tool is moved away from the second bond to leave a small portion of the wire exposed out of the capillary wedge bonding tool. The wire is clamped and the bonding tool is then moved in a predetermined direction away from the second bond to break the wire and form a wire bonding tail. The predetermined direction of movement is at an angle which properly aligns the wire bonding tail in an angular direction under the annular working face of the capillary wedge bonding tool without the necessity of rotating the wedge bonding tool relative to the semiconductor chip.

REFERENCES:
patent: 3444612 (1969-05-01), Pennings
patent: 3460238 (1969-08-01), Christy
patent: 3623649 (1971-11-01), Keisling
patent: 3643321 (1972-02-01), Field
patent: 4230925 (1980-10-01), Lascelles
patent: 4340166 (1982-07-01), Bilane

Affiliated with

Also associated with

Rating

Method of making fine wire interconnections does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of making fine wire interconnections, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making fine wire interconnections will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1599591