Metal working – Method of mechanical manufacture – Electrical device making
Patent
1991-05-24
1992-10-06
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
174 524, 357 70, H01R 4300
Patent
active
051520540
ABSTRACT:
A structure and method are disclosed for tape automated bonding (TAB) assembly processes which provide for reduced manufacturing costs, greater film strength, and greater usable film area so that larger chips can be accommodated on a given size film. Common lines, which prevent the buildup of voltage differences between leads, are cut away before electrical testing by means of a knife that slices away the common line conductors parallel to the film surface rather than punching through the conductive leads attached to the common lines and underlying film. By eliminating the punch-outs more room is made available for large chips, film strength is not reduced because of multiple punch-outs, and manufacturing costs are reduced because product-specific punching tools are no longer required.
REFERENCES:
patent: 4331740 (1982-05-01), Burns
patent: 4380042 (1983-04-01), Angelucci et al.
patent: 4806409 (1989-02-01), Walter et al.
patent: 4903401 (1990-02-01), Webb
patent: 4927491 (1990-05-01), Masaki
patent: 5028614 (1991-04-01), Shreeve et al.
patent: 5036380 (1991-07-01), Chase
Arbes Carl J.
Seiko Epson Corporation
Werner Raymond J.
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