Method of making exposed pad ball grid array package

Details Method of making exposed pad ball grid array package Method of making exposed pad ball grid array package

2007-10-16

2007-10-16

Dang, Trung (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S124000, C257SE21511, C257SE21512, C257SE21516

Reexamination Certificate

active

11297103

ABSTRACT:
A method of making an exposed-pad ball-grid array package (11) includes applying a conductive sheet (16) to an adhesive tape (18). Stamping the conductive sheet (16) to form a die pad (24) and separating the remainder (26) of the sheet from the adhesive tape (18) so that only the die pad (24) remains on the adhesive tape (18). A substrate (28) is applied to the adhesive tape (18) proximate to the die pad (24). A die (30) is attached to the die pad (24) and electrically coupled to the substrate (28). An encapsulant (34) is formed around at least a portion of the die (30), the die pad (24) and the substrate (28) above the adhesive tape (18). The adhesive tape (18) is removed from the die pad (24), substrate (28) and encapsulant (34). Conductive balls (36) are attached to the substrate (28).

REFERENCES:
patent: 6744125 (2004-06-01), Carmenforte et al.
patent: 6798057 (2004-09-01), Bolkin et al.
patent: 6940154 (2005-09-01), Pedron et al.
patent: 7154166 (2006-12-01), Ano
patent: 7183134 (2007-02-01), Lee et al.
patent: 2004/0084771 (2004-05-01), Bolken et al.
patent: 2005/0211465 (2005-09-01), Sunohara et al.

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